For the third year, in conjunction with the Thermosense XXIX conference, hardware, and software vendors will give a brief presentation on what is new for this year in their product lines that impact thermal imaging practices and applications.

Monday 9 April - Room: Grand 8B Mon. 5:30 to 8:00 p.m.
Chairs: Andrés E. Rozlosnik, SI Termografía Infrarroja (Argentina); G. Raymond Peacock, Temperatures.com, Inc.

What's New in Hardware and Software at the 2007 DSS Exhibition?

NOTE: Companies presenting are listed in inverse alphabetical order. Estimated time for each presentation is 11 minutes. All companies listed below have a booth at the exhibit hall. The Exhibition Floor Plan can be found in the Exhibition Guide or online spie.org/events/dssexhibit.

Thermoteknix Systems, Ltd. (Booth 817)

Advances in uncooled thermal imaging for harsh operational requirements

Presenter: Richard Salisbury, President

Surface Optics Corp. (Booth 1848)

Emissivity measurements with a hand held reflectometer

Presenter: M. Martin Szczesniak, Industrial Spectroscopy Div.

Surface Finishes -- Cabot Microelectronics (Booth 1005)

Super-polished aluminum mirrors

Presenter: Roman Salij, Market Development Manager

SUI (Sensors Unlimited, Inc.), part of the Goodrich Corp. (Booth 801)

The versatile short-wave infrared KT platform

Presenter: Marc Hansen, Applications Engineer

SCD-Semi Conductor Devices (Booth 1706)

Last advances in cooled and uncooled SCD detectors

Presenter: Fabian Schapiro, Marketing manager

RedShift Systems (Booth 921)

Optical Thermal Imaging for Mass Market Applications

Presenter: Stuart Nixdorff, Co-founder, VP of Sales and Marketing

PVP Advanced E.O. Systems, Inc. (Booth 918)

Ultra-high range surveillance system with visible and infrared capabilities

Presenter: Goeffrey Miller, Manager Program and Business Development

OPGAL Optronic Industries Ltd. (Booth 1723)

Thermal infrared software development kit

Presenter: Dror Sharon, Vice President Marketing

NEC Corp. (Booth 1546)

IR camera module from NEC

Presenter: Jun Mochizuki, Senior Manager, Sales Promotion, Guidance and Electro-Optics Division

Lockheed Martin, Santa Barbara Focalplane (Booth 911)

The digital advantage in focal plane

Presenter: Arnold Adams, Senior Application Scientist

JCD Publishing Co. (Booth 1801)

Imaging systems performances simulation

Presenter: Gerald C. Holst, President

IRCAM GmbH (Booth 4)

IRCAM Geminis 110k ML: first commercial dual band infrared camera in the world

Presenter: Mónica López Sáenz, Managing Director and Co-founder

DRS Sensors & Targeting Systems (Booth 400)

DRS Ultra-low power, compact MWIR and LWIR sensor modules

Presenter: Mike Scholten, VP of Business Development for Electro Optical Components & Technology

Critical Imaging LLC (Booth 1449)

Modular thermal imaging system for security, surveillance, and industrial applications

Presenter: Jonathan Knauth, PE Technical Director

CEDIP Infrared Systems (Booth 311)

New advances on stress analysis using a CEDIP infrared systems/software

Presenter: Pierre Brémond, Export sales manager Industrial application and thermography