Vendor Presentations and Reception IV - Date: Monday 17 March
Time: 5:00 PM - 8:00 PM --Location: Crystal M --- Orlando World Center Marriott Resort and Convention Center
Orlando, FL USA- Session Chairs: AndrĂ©s E. Rozlosnik, SI TermografĂa Infrarroja (Argentina); G. Raymond Peacock, Temperatures.com, Inc.
For the forth year, in conjunction with the ThermoSense XXX conference, hardware and software vendors will give a brief presentation on what is new this year in their product lines that impact thermal imaging practices and applications.
All presenting companies have a booth in the exhibition hall.
The intent of this workshop is to bring together Vendors and Early Arrival ThermoSense and DSS attendees to highlight the newest products and services being shown at the Exhibition. In this way the busy technical conference attendees can better prioritize their activities when visiting the exhibits.
It is also a relaxed opportunity for getting to know one another better and to have informal discussions on matters of mutual interest.
A limited time for 10 to 15 minute vendor presentations starts the session, followed by a reception with snacks and soft drinks.
AVIO-Nippon Avionics Co., Ltd. (Booth 1417)
New IR Thermography Products from Nippon Avionics
Presenter: Yukinori Kimura, Manager, Partner Business Dept.
Cantronic Systems, Inc. (Booth 518)
Thermal Surveillance Relationship Between Target Distance and Pixels
Presenter: Jon Chynoweth, Executive Vice President
Cedip Infrared Systems (Booth 1317)
High-spatial Resolution Thermal Inaging Cameras and Portable Cameras for R&D Applications
Presenter: Pierre Bremond, Export Sales Manager, Industrial Applications and Thermography
Electrophysics Corp. (Booth 413)
640 X 480 Thermography Camera with Dual Laser Sighting
Presenter: Art Stout, Vice President, Business Development
FLIR Systems, Inc.-Commercial Vision Systems (Booth 603)
FLIR's Commercial Uncooled Cores: Automotive, Fire Fighting, and Military Applications
Presenter: Jay James, Vice President of Business Development for Cores and Components
Infrared Cameras Inc. (Texas Infrared) (Booth 1105)
ICI Prodigy and ICI Mirage: Medical, Aerospace, and Petrochemical Applications
Presenter: Gary Strahan, President
IRCAM GmbH (Booth 17)
New IR Cameras, Systems, and Software for IR Imaging and Thermography
Presenter: Monica Lopez Saenz, Managing Director and Co-Founder
Jenoptik-IR (Booth 1427)
Infrared Relay Lens for High-magnetic Environment Applications
Presenter: Ray Watts, Sales Manager
NEC Corp. (Booth 1417)
New Infrared Detector Module from NEC
Presenter: Hiroaki Ono, Assistant Manager
NEC San-ei Instruments, Ltd. (booth 1417)
Sensor Fusion Solution with TS9230/TS9260-New Fixed-mount Thermal Imaging Network Camera with Ruggedness and Reliability
Presenter: Tetsuo Tamura, Senior General Manager, Infrared Systems Dept.
Santa Barbara Infrared, Inc. (Booth 503)
Automated Testing of IR/EO Sensor Systems
Presenter: Alan Irwin, Senior Systems Engineer
SCD-SemiConductor Devices (Booth 903)
BIRD640 and SCD's Road Map for Uncooled Products
Presenter: Fabian Schapiro, Marketing Manager
Sensors Unlimited, Inc., (part of Goodrich Corp.) (Booth 717)
Extending InGaAs Wavelength Response: Advancements in InGaAs Technology and Applications
Presenter: Marc Hansen, Applications Engineer
StingRay Optics, LLC (Booth 1311)
Optics for NIR/SWIR Imaging
Presenter: Jennifer Myers, Sales and Marketing Manager
Surface Optics Corp. (Booth 907)
Field Emissivity Measurements Increase Accuracy of Temperature Predictions
Presenter: Brian Catanzaro, Consultant
Thermoteknix Systems Ltd. (Booth 1111)
Continued Advances in Miricle Increase Thermal Imaging Cameras from Thermoteknix
Presenter: Alistair Brown, Product Manager, Imaging
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