For the third year, in conjunction with the Thermosense XXIX conference, hardware, and software vendors will give a brief presentation on what is new for this year in their product lines that impact thermal imaging practices and applications.
NOTE: Companies presenting are listed in inverse alphabetical order. Estimated time for each presentation is 11 minutes. All companies listed below have a booth at the exhibit hall. The Exhibition Floor Plan can be found in the Exhibition Guide or online spie.org/events/dssexhibit.
Thermoteknix Systems, Ltd. (Booth 817)
Advances in uncooled thermal imaging for harsh operational requirements
Presenter: Richard Salisbury, President
Surface Optics Corp. (Booth 1848)
Emissivity measurements with a hand held reflectometer
Presenter: M. Martin Szczesniak, Industrial Spectroscopy Div.
Surface Finishes -- Cabot Microelectronics (Booth 1005)
Super-polished aluminum mirrors
Presenter: Roman Salij, Market Development Manager
SUI (Sensors Unlimited, Inc.), part of the Goodrich Corp. (Booth 801)
The versatile short-wave infrared KT platform
Presenter: Marc Hansen, Applications Engineer
SCD-Semi Conductor Devices (Booth 1706)
Last advances in cooled and uncooled SCD detectors
Presenter: Fabian Schapiro, Marketing manager
RedShift Systems (Booth 921)
Optical Thermal Imaging for Mass Market Applications
Presenter: Stuart Nixdorff, Co-founder, VP of Sales and Marketing
PVP Advanced E.O. Systems, Inc. (Booth 918)
Ultra-high range surveillance system with visible and infrared capabilities
Presenter: Goeffrey Miller, Manager Program and Business Development
OPGAL Optronic Industries Ltd. (Booth 1723)
Thermal infrared software development kit
Presenter: Dror Sharon, Vice President Marketing
NEC Corp. (Booth 1546)
IR camera module from NEC
Presenter: Jun Mochizuki, Senior Manager, Sales Promotion, Guidance and Electro-Optics Division
Lockheed Martin, Santa Barbara Focalplane (Booth 911)
The digital advantage in focal plane
Presenter: Arnold Adams, Senior Application Scientist
JCD Publishing Co. (Booth 1801)
Imaging systems performances simulation
Presenter: Gerald C. Holst, President
IRCAM GmbH (Booth 4)
IRCAM Geminis 110k ML: first commercial dual band infrared camera in the world
Presenter: Mónica López Sáenz, Managing Director and Co-founder
DRS Sensors & Targeting Systems (Booth 400)
DRS Ultra-low power, compact MWIR and LWIR sensor modules
Presenter: Mike Scholten, VP of Business Development for Electro Optical Components & Technology
Critical Imaging LLC (Booth 1449)
Modular thermal imaging system for security, surveillance, and industrial applications
Presenter: Jonathan Knauth, PE Technical Director
CEDIP Infrared Systems (Booth 311)
New advances on stress analysis using a CEDIP infrared systems/software
Presenter: Pierre Brémond, Export sales manager Industrial application and thermography